| c | File Name | Size | files | Vc | Fmt | Res | T | Date |
|---|---|---|---|---|---|---|---|---|
| - | Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices - JEDEC Solid State Technology Association.jpg | 123810 | mjpeg | image2 | 1275x1650 | jpg | 2026-05-10 08:03:23 | |
| - | Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices - JEDEC Solid State Technology Association.opf | 2537 | opf | 2026-05-10 08:03:23 | ||||
| - | Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices - JEDEC Solid State Technology Association.pdf | 900305 | 2026-05-10 08:08:08 |
Looks like javascript is broken; see "csp nonce" section in readme
π